Semiconductor arrangement and method of making

ABSTRACT

A semiconductor arrangement and method of forming the semiconductor arrangement are provided. The semiconductor arrangement includes a device having a first surface and a second surface opposite the first surface. A first through substrate via (TSV) structure extends between the first surface and the second surface in a first region of the device. A second TSV structure extends between the first surface and the second surface in a second region of the device. The first TSV structure has a first cross-sectional area. The second TSV structure has a second cross-sectional area greater than the first cross-sectional area.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent Application63/166,732, filed on Mar. 26, 2021, which is incorporated herein byreference.

BACKGROUND

Semiconductor arrangements are used in a multitude of electronicdevices, such as mobile phones, laptops, desktops, tablets, watches,gaming systems, and various other industrial, commercial, and consumerelectronics. Semiconductor arrangements generally comprise semiconductorportions and wiring portions formed inside the semiconductor portions.

DESCRIPTION OF THE DRAWINGS

Aspects of the disclosure are understood from the following detaileddescription when read with the accompanying drawings. It will beappreciated that elements and/or structures of the drawings are notnecessarily be drawn to scale. Accordingly, the dimensions of thevarious features may be arbitrarily increased and/or reduced for clarityof discussion.

FIG. 1 is a cross-section view of a semiconductor arrangement, inaccordance with some embodiments.

FIG. 2 is a cross-section view of a semiconductor arrangement, inaccordance with some embodiments.

FIGS. 3-7 and 7A are top views of a semiconductor arrangement, inaccordance with some embodiments.

FIG. 8 is a flow chart illustrating a method of handling a semiconductorsubstrate, in accordance with some embodiments.

FIG. 9 illustrates an example computer-readable medium whereinprocessor-executable instructions configured to embody one or more ofthe provisions set forth herein may be comprised, in accordance withsome embodiments.

FIG. 10 illustrates an example computing environment wherein one or moreof the provisions set forth herein may be implemented, in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper”, and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

One or more techniques for forming a semiconductor arrangement andresulting structures formed thereby are provided herein. To allowvertical stacking of devices to increase density, some devices includethrough silicon via (TSV) structures that extend from a top surface ofthe device to a bottom surface of the device to allow signals to bepassed vertically to another device below and/or above the subjectdevice. According to some embodiments, a first TSV structure formed in afirst region of a device has a first cross-sectional area less than afirst cross-sectional area of a second TSV structure formed in a secondregion of the device. The first cross-sectional area and the secondcross-sectional area are taken in the same plane.

For many applications, a low voltage power domain has more cells andoccupies a larger portion of a design as compared to a high voltagepower domain that has relatively fewer cells and occupies a relativelysmaller portion of the design. For example, a low voltage domain mayinclude a core region of the device or a memory region of the device,and a high voltage domain may include an input/output region of thedevice or a power supply region of the device. Power losses ininterconnect structures, such as TSV structures, are dependent on thevoltage of the signal and the resistance of the TSV structure. Providinga TSV structure with a larger cross-sectional area in a high voltagedomain decreases power loss.

FIG. 1 is a cross-section view illustrating a portion of a semiconductorarrangement 100 according to some embodiments. In some embodiments, thesemiconductor arrangement 100 is formed on a substrate layer 105comprising at least one of an epitaxial layer, a single crystallinesemiconductor material, such as, but not limited to, at least one of Si,Ge, SiGe, InGaAs, GaAs, InSb, GaP, GaSb, InAlAs, GaSbP, GaAsSb, or InP,a silicon-on-insulator (SOI) structure, a wafer, or a die formed from awafer. In some embodiments, the substrate layer 105 comprises at leastone of crystalline silicon or other suitable materials. Other structuresand/or configurations of the substrate layer 105 are within the scope ofthe present disclosure.

According to some embodiments, the semiconductor arrangement 100comprises a first region 110 and a second region 115. In someembodiments, the first region 110 is a core region, a memory region,and/or a logic region with a semiconductor device 120 in a first voltagedomain operating according to a first supply voltage. In someembodiments, the second region 115 is an input/output region or a powersupply region with a semiconductor device 125 in a second voltage domainoperating according to a second supply voltage. For example, the firstsupply voltage in the first region 110 may be less than the secondsupply voltage in the second region 115.

In some embodiments, the first region 110 is formed on or within thesubstrate layer 105. In some embodiments, the first region 110 comprisesthe semiconductor device 120 formed on or within the substrate layer105. In some embodiments, the semiconductor device 120, which may be atransistor, comprises a gate structure 130, source/drain regions 135, asidewall spacer 140, a gate cap layer 145, etc. According to someembodiments, the gate structure 130 is formed by forming a sacrificialgate structure comprising a sacrificial gate dielectric layer, asacrificial polysilicon layer, and a hard mask layer. In someembodiments, a patterning process is performed to pattern the hard masklayer corresponding to the pattern of gate structures to be formed, andan etch process is performed using the patterned hard mask layer to etchthe sacrificial polysilicon layer and the sacrificial gate dielectriclayer to define the sacrificial gate structure. In some embodiments,remaining portions of the hard mask layer form a cap layer over theportions of the sacrificial polysilicon layer remaining after the etchprocess. In some embodiments, the sacrificial gate structure is laterreplaced with a replacement gate dielectric layer and a replacement gateelectrode (not separately shown).

In some embodiments, a gate dielectric layer of the gate structure 130,such as the replacement gate dielectric layer, comprises a high-kdielectric material. As used herein, the term “high-k dielectric” refersto the material having a dielectric constant, k, greater than or equalto about 3.9, which is the k value (dielectric constant) of SiO₂. Thematerial of the high-k dielectric layer may comprise any suitablematerials. Examples of the material of the high-k dielectric layerinclude, but are not limited to, Al₂O₃, HfO₂, ZrO₂, La₂O₃, TiO₂, SrTiO₃,LaAlO₃, Y₂O₃, Al₂O_(x)N_(y), HfO_(x)N_(y), ZrO_(x)N_(y), La₂O_(x)N_(y),TiO_(x)N_(y), SrTiO_(x)N_(y), LaAlO_(x)N_(y), Y₂O_(x)N_(y), SiON,SiN_(x), a silicate thereof, an alloy thereof, and/or other suitablematerials. Each value of x is independently from 0.5 to 3, and eachvalue of y is independently from 0 to 2. In some embodiments, the gatedielectric layer comprises a native oxide layer formed by exposure ofthe semiconductor arrangement 100 to oxygen at various points in theprocess flow, causing the formation of silicon dioxide on exposedsurfaces. In some embodiments, an additional layer of dielectricmaterial, such as comprising silicon dioxide, a high-k dielectricmaterial, and/or other suitable materials, is formed over the nativeoxide to form the gate dielectric layer.

In some embodiments, a gate electrode of the gate structure 130, such asthe replacement gate electrode, comprises a barrier layer, one or morework function material layers, a seed layer, a metal fill layer, and/orother suitable layers. In some embodiments, the metal fill layercomprises tungsten, aluminum, copper, cobalt, and/or other suitablematerials. In some embodiments, the gate dielectric layer and/or the oneor more layers that comprise the gate electrode are formed by at leastone of atomic layer deposition (ALD), physical vapor deposition (PVD),chemical vapor deposition (CVD), low pressure CVD (LPCVD), atomic layerchemical vapor deposition (ALCVD), ultrahigh vacuum CVD (UHVCVD),reduced pressure CVD (RPCVD), molecular beam epitaxy (MBE), or othersuitable techniques. In some embodiments, the gate electrode is recessedto define a recess, and the gate cap layer 145 is formed in the recess.

In some embodiments, the sidewall spacer 140 is formed adjacent the gatestructure 130. In some embodiments, the sidewall spacer 140 is formed bydepositing a spacer layer over the gate structure 130 and performing ananisotropic etch process to remove horizontal portions of the spacerlayer, such as to expose at least some of the substrate layer 105. Insome embodiments, the sidewall spacer 140 comprises silicon nitrideand/or other suitable materials.

In some embodiments, the source/drain regions 135 are formed in thesubstrate layer 105 after forming the gate structure 130. For example,in some embodiments, portions of the substrate layer 105 are dopedthrough an implantation process to form the source/drain regions 135. Insome embodiments, an etch process is performed to recess the substratelayer 105 adjacent the sidewall spacer 140, and an epitaxial growthprocess is performed to form the source/drain regions 135. Otherstructures and/or configurations of the semiconductor device 120 arewithin the scope of the present disclosure.

In an embodiment, the second region 115 is formed on or within thesubstrate layer 105. In some embodiments, the second region 115comprises the semiconductor device 125 formed on or within the substratelayer 105. In some embodiments, the semiconductor device 125, which maybe a transistor, comprises a gate structure 150, source/drain regions155, a sidewall spacer 160, a gate cap layer 165, etc. In someembodiments, one or more processes described for forming thesemiconductor device 120 may be used to form the semiconductor device125. In some embodiments, one or more materials described for formingthe semiconductor device 120 may be used to form the semiconductordevice 125. In some embodiments, at least some different materials areused due to the different voltage domain. For example, the gatedielectric material may be different and/or may have a differentthickness in the semiconductor device 125 compared to the semiconductordevice 120. In some embodiments, the materials of the gate electrode mayalso differ in the semiconductor device 125 compared to thesemiconductor device 120. Other structures and/or configurations of thesemiconductor device 125 are within the scope of the present disclosure.

In some embodiments, one or more shallow trench isolation (STI)structures 170 are formed within the substrate layer 105. In someembodiments, the STI structures 170 are formed by forming at least onemask layer over the substrate layer 105. In some embodiments, the masklayer comprises a layer of oxide material over the substrate layer 105,a layer of nitride material over the layer of oxide material, and/or oneor more other suitable layers. At least some of the layer of mask layeris removed to define an etch mask for use as a template to etch thesubstrate layer 105 to form trenches. A dielectric material is formed inthe trenches to define the STI structures 170. In some embodiments, theSTI structures 170 include multiple layers, such as an oxide liner, anitride liner formed over the oxide liner, an oxide fill material formedover the nitride liner, and/or other suitable materials.

In some embodiments, a fill material of the STI structures 170 is formedusing a high density plasma (HDP) process. The HDP process usesprecursor gases comprising at least one of silane (SiH₄), oxygen, argon,or other suitable gases. The HDP process includes a depositioncomponent, which forms material on surfaces defining the trenches, and asputtering component, which removes or relocates deposited material. Adeposition-to-sputtering ratio depends on gas ratios employed during thedeposition. According to some embodiments, argon and oxygen act assputtering sources, and the particular values of the gas ratios aredetermined based on aspect ratios of the trenches. After forming thefill material, an anneal process is performed to densify the fillmaterial. In some embodiments, the STI structures 170 generatecompressive stress that serves to compress the first region 110 and/orthe second region 115

Although the substrate layer 105 and the STI structures 170 areillustrated as having coplanar upper surfaces at an interface where thesubstrate layer 105 abuts the STI structures 170, the relative heightscan vary. For example, the STI structures 170 can be recessed relativeto the substrate layer 105, or the substrate layer 105 can be recessedrelative to the STI structures 170. The relative heights at theinterface depend on the processes performed for forming the STIstructures 170, such as at least one of deposition, planarization, maskremoval, surface treatment, or other suitable techniques. In someembodiments, the STI structures 170 are formed prior to forming thesemiconductor devices 120, 125. Other structures and/or configurationsof the STI structures 170 are within the scope of the presentdisclosure.

In some embodiments, a dielectric layer 175 is formed over thesemiconductor devices 120, 125. In some embodiments, the dielectriclayer 175 is formed prior to replacing the gate structures. In someembodiments, the dielectric layer 175 comprises silicon dioxide, a low-kmaterial, and/or other suitable materials. A low-k layer is, in someembodiments, further characterized or classified as ultra low-K (ULK),extra low-K (ELK), or extreme low-k (XLK), where the classification isgenerally based upon the k value. For example, ULK generally refers tomaterials with a k value of between about 2.7 to about 2.4, ELKgenerally refers to materials with a k value of between about 2.3 toabout 2.0, and XLK generally refers to materials with a k value of lessthan about 2.0. In some embodiments, the dielectric layer 175 comprisesone or more layers of low-k dielectric material. Low-k dielectricmaterials have a k value lower than about 3.9. In some embodiments, thematerials for the dielectric layer 175 comprise at least one of Si, O,C, or H, such as SiCOH, SiOC, oxygen-doped SiC (ODC), nitrogen-doped SiC(NDC), plasma-enhanced oxide (PEOX), and/or other suitable materials.Organic material, such as polymers, may be used for the dielectric layer175. In some embodiments, the dielectric layer 175 comprises one or morelayers of a carbon-containing material, organo-silicate glass, aporogen-containing material, and/or other suitable materials. Thedielectric layer 175 comprises nitrogen in some embodiments. In someembodiments, the dielectric layer 175 is formed by using, for example,at least one of CVD, plasma-enhanced chemical vapor deposition (PECVD),LPCVD, ALCVD, a spin-on technology, or other suitable techniques. Insome embodiments, the dielectric layer 175 comprises one or more layers,at least some of which may have a same material composition. In someembodiments, there are one or more layers of the dielectric layer 175,at least some of which may have a same material composition. Otherstructures and/or configurations of the dielectric layer 175 are withinthe scope of the present disclosure.

In some embodiments, the first region 110 comprises one or moreconductive contacts 180 formed in the dielectric layer 175 andelectrically connected to the semiconductor device 120 within the firstregion 110. In some embodiments, the second region 115 comprises one ormore conductive contacts 185 formed in the dielectric layer 175 andelectrically connected to the semiconductor device 125 within the secondregion 115. The conductive contacts 180, 185 are formed in any number ofways, such as by a single damascene process, a dual damascene process, atrench silicide process, and/or other suitable techniques. In someembodiments, additional contacts (not shown) are formed to contact thesemiconductor device 120 and/or the semiconductor device 125 indifferent positions, such as into or out of the page. In someembodiments, the conductive contacts 180, 185 comprise a barrier layer,a seed layer, a metal fill layer, and/or other suitable layers. In someembodiments, the metal fill layer comprises tungsten, aluminum, copper,cobalt, and/or other suitable materials. Other structures and/orconfigurations of the conductive contacts 180, 185 are within the scopeof the present disclosure. In some embodiments, at least one of thesemiconductor devices 120, 125, the conductive contacts 180, 185, thedielectric layer 175, the substrate layer 105, or the STI structures 170define a device layer 190 of the semiconductor arrangement 100.

In some embodiments, the semiconductor arrangement 100 comprises one ormore dielectric layers 195 formed over the device layer 190. Accordingto some embodiments, the one or more dielectric layers 195 comprise asecond dielectric layer 195 a, a third dielectric layer 195 b, a fourthdielectric layer 195 c, and an n-th dielectric layer 195 n. Any numberof dielectric layers are contemplated. In some embodiments, at least oneof the dielectric layers 195 comprises a material with a dielectricconstant of 3.9 or above, such as SiO₂. In some embodiments, at leastone of the dielectric layers 195 comprises a dielectric material with arelatively low dielectric constant, as described for the dielectriclayer 175. The dielectric layers 195 are formed in any number of ways,such as by thermal growth, chemical growth, ALD, CVD, PECVD, and/orother suitable techniques. In some embodiments, one or more of thedielectric layers 195 in a lower portion comprise ULK or ELK dielectricmaterials, one or more of the dielectric layers 195 in an intermediateportion comprise low-k dielectric materials, and one or more of thedielectric layers 195 in an upper portion comprise dielectric materials,such as doped or undoped silicon glass.

In some embodiments, the semiconductor arrangement 100 comprises one ormore etch stop layers 200 separating the dielectric layers 195. In someembodiments, the etch stop layers 200 stop an etching process betweenthe dielectric layers 195. According to some embodiments, the etch stoplayers 200 comprise a dielectric material having a different etchselectivity from the dielectric layers 195. In some embodiments, atleast one of the etch stop layers 200 comprises SiN, SiCN, SiCO, and/orCN. The etch stop layers 200 are formed in any number of ways, such asby thermal growth, chemical growth, ALD, CVD, PECVD, and/or othersuitable techniques.

In some embodiments, the semiconductor arrangement 100 comprises one ormore conductive contacts 205 electrically connected to the conductivecontacts 180, 185. In some embodiments, the conductive contacts 205extend through respective dielectric layers 195. In some embodiments, atleast some of the conductive contacts 205 comprise a via portion 205Vand a line portion 205L. The line portions 205L are wider than the viaportions 205V, and the line portions 205L have an axial length extendinginto the page. In some embodiments, the conductive contacts 205 comprisea barrier layer, a seed layer, a metal fill layer, and/or other suitablelayers. In some embodiments, the metal fill layer comprises tungsten,aluminum, copper, cobalt, and/or other suitable materials. Otherstructures and/or configurations of the conductive contacts 205 arewithin the scope of the present disclosure. In some embodiments, acombination of a particular dielectric layer 195 and one or moreconductive contacts 205 in the particular dielectric layer 195 define ametallization layer of the semiconductor arrangement 100, such as layers“M0,” “M1,” “M2”, and “Mx.”

In some embodiments, a first TSV structure 210 is formed in the firstregion 110 and a second TSV structure 215 is formed in the second region115. In some embodiments, the TSV structures 210, 215 extend through thesubstrate layer 105 and the dielectric layers 175, 195 a-195 n. In someembodiments, the TSV structures 210, 215 comprise a barrier layer, aseed layer, a metal fill layer, and/or other suitable layers. In someembodiments, the metal fill layer comprises tungsten, aluminum, copper,cobalt, and/or other suitable materials. In some embodiments, additionalTSV structures are provided in the first region 110 and/or the secondregion 115. Other structures and/or configurations of the TSV structures210, 215 are within the scope of the present disclosure.

In some embodiments, at least one passivation layer 220 is formed overthe dielectric layer 195 n. In some embodiments, the passivation layer220 comprises silicon oxide/silicon nitride (SiO₂/Si₃N₄), titaniumnitride, doped silicon dioxide, polyimide, and/or other suitablematerials. In some embodiments, the passivation layer 220 is formed byALD, CVD, PECVD, and/or other suitable techniques. Other structuresand/or configurations of the passivation layer 220 are within the scopeof the present disclosure.

In some embodiments, conductive contact pads 225, 230 are formed in thepassivation layer 220. In some embodiments, the passivation layer 220includes multiple layers, where the conductive contact pads 225, 230 areformed in a first layer of the passivation layer 220 and an additionallayer of passivation material is formed over the conductive contact pads225, 230 and patterned to expose upper surfaces of the conductivecontact pads 225, 230. In some embodiments, the conductive contact pads225, 230 are electrically connected to the TSV structures 210, 215 andcomprise aluminum and/or other suitable materials. Other structuresand/or configurations of the conductive contact pads 225, 230 are withinthe scope of the present disclosure.

In some embodiments, a polyimide layer 235 is formed over thepassivation layer 220 and patterned to expose the conductive contactpads 225, 230. In some embodiments, the polyimide layer 235 is aphotosensitive polyimide layer that is patterned with photolithographyand can, after patterning and etching, remain on the surface of thepassivation layer 220 on which the polyimide layer 235 has beendeposited to serve as a second passivation layer. In some embodiments, aprecursor of the polyimide layer 235 is first deposited by spin coatingand/or other suitable techniques. The precursor is, after a lowtemperature pre-bake, exposed to electromagnetic radiation using a lightsource and a reticle. Portions of the precursor that are exposed arecross-linked thereby leaving unexposed portions (that are notcross-linked) over the conductive contact pads 225, 230. Duringsubsequent development, the unexposed portions over the conductivecontact pads 225, 230 are dissolved, thereby providing openings over theconductive contact pads 225, 230. In some embodiments, a thermal curingprocess is performed on the polyimide layer 235. Other structures and/orconfigurations of the polyimide layer 235 are within the scope of thepresent disclosure.

In some embodiments, solder bumps 240, 245 are formed over the polyimidelayer 235 and are electrically connected to the conductive contact pads225, 230. In some embodiments, an under-bump metal layer (not shown),such as comprising nickel and/or other suitable materials, is formedover the conductive contact pads 225, 230 prior to forming the solderbumps 240, 245. In some embodiments, the solder bumps 240, 245 areformed by applying a flux and/or paste to a solder material andperforming a thermal reflowing process. Other structures and/orconfigurations of the solder bumps 240, 245 are within the scope of thepresent disclosure. In some embodiments, the solder bumps 240, 245 areomitted and external contact to the TSV structures 210, 215 isfacilitated by the conductive contact pads 225, 230.

In some embodiments, at least one passivation layer 250 is formed over(or under) the substrate layer 105. For example, in some embodiments,the semiconductor arrangement 100 is flipped during processing such abottom surface of the substrate layer 105 as shown in FIG. 1 facesupward, and the passivation layer 250 is formed on the bottom surface ofthe substrate layer 105 (thereby forming the passivation layer 250 overthe substrate layer 105 while the semiconductor arrangement is flipped).In some embodiments, the passivation layer 250 comprises siliconoxide/silicon nitride (SiO₂/Si₃N₄), titanium nitride, doped silicondioxide, polyimide, and/or other suitable materials. In someembodiments, the passivation layer 250 is formed by ALD, CVD, PECVD,and/or other suitable techniques. Other structures and/or configurationsof the passivation layer 250 are within the scope of the presentdisclosure.

In some embodiments, conductive contact pads 255, 260 are formed in thepassivation layer 250. In some embodiments, the passivation layer 250includes multiple layers, where the conductive contact pads 255, 260 areformed in a first layer of the passivation layer 250 and an additionallayer of passivation material is formed over the conductive contact pads255, 260 and patterned to expose upper surfaces of the conductivecontact pads 255, 260. In some embodiments, the conductive contact pads255, 260 are electrically connected to the TSV structures 210, 215 andcomprise aluminum and/or other suitable materials. Other structuresand/or configurations of the conductive contact pads 255, 260 are withinthe scope of the present disclosure.

In some embodiments, the conductive contact pads 225, 230 and/or thesolder bumps 240, 245 facilitate front-side connections to thesemiconductor arrangement 100, and the conductive contact pads 255, 260facilitate back-side connections to the semiconductor arrangement 100.In some embodiments, one or more of the conductive contacts 205 areconductively coupled to the TSV structures 210, 215, thereby supplyingpower to the semiconductor device 120 and/or the semiconductor device125.

Referring to FIGS. 2 and 3, a cross-section view and a top view of asemiconductor arrangement 100 comprising stacked devices 300A, 300B,300C, 300D are provided, in accordance with some embodiments. Thecross-section view in FIG. 2 is taken along line 2-2 shown in FIG. 3.The uppermost device 300D is visible in FIG. 3. The devices 300A, 300B,300C, 300D each comprise a device layer 305A, 305B, 305C, 305D and ametallization layer 310A, 310B, 310C, 310D. The metallization layers310A, 310B, 310C, 310D may include multiple layers, such as themetallization layers M0-Mx shown in FIG. 1. In some embodiments, themetallization layers 310A, 310B, 310C, 310D each comprise thepassivation layers 220, 250, the polyimide layer 235, and the conductivecontact pads 225, 230, 255, 260. At least some of the devices 300A,300B, 300C, 300D comprise the first region 110 including the TSVstructure 210, the second region 115 including the TSV structure 215,and a third region 117 including a TSV structure 217. In someembodiments, the TSV structures 210 in the devices 300A, 300B, 300C,300D conductively contact the TSV structures 210 in the verticallyadjacent devices 300A, 300B, 300C, 300D (e.g., the TSV structure 210 inthe device 300A conductively contacts the TSV structure 210 in thedevice 300B, the TSV structure 210 in the device 300B conductivelycontacts the TSV structures 210 in the devices 300A, 300C, etc.), theTSV structures 215 in the devices 300A, 300B, 300C, 300D conductivelycontact the TSV structures 215 in the vertically adjacent devices 300A,300B, 300C, 300D, and the TSV structures 217 in the devices 300A, 300B,300C, 300D conductively contact the TSV structures 217 in the verticallyadjacent devices 300A, 300B, 300C, 300D. In some embodiments, the TSVstructures 210, 215, 217 do not extend through the lowermost device300A, but rather, the TSV structures 210, 215, 217 conductively contactconductive contact pads on the uppermost surface of the device 300A.

In some embodiments, the first region 110 comprises a core region, thesecond region 115 comprises an input/output (I/O) region, and the thirdregion 117 comprises a power distribution region. In some embodiments,the first region 110 and the second region 115 operate using differentsupply voltages. In some embodiments, a first supply voltage of thefirst region 110 is less than a second supply voltage of the secondregion 115. In some embodiments, the third region 117 is a power planefor providing power for the devices 300A, 300B, 300C, 300D at the secondsupply voltage, which is stepped down to the first supply voltage tosupply power to the first region 110. With reference to FIG. 3, in someembodiments, the TSV structure 210 has a first cross-sectional area(measured in a plane perpendicular to a top surface of the substratelayer 105), the TSV structure 215 has a second cross-sectional areagreater than the first cross-sectional area, and the TSV structure 217has a third cross-sectional area greater than the second cross-sectionalarea. The first cross-sectional area, the second cross-sectional area,and the third cross-sectional area are compared in the same plane, sincethe TSV structures 210, 215, 217 may taper along their lengths, L,(extending in a direction perpendicular to the top surface of thesubstrate layer). The increased cross-sectional areas of the TSVstructures 215, 217 result in reduced resistive power losses. In someembodiments, the first region 110 has an increased density of TSVstructures 210 compared to the density of the TSV structures 215, 217 inthe regions 115, 117, tending to increase performance in the firstregion 110.

Referring to FIG. 4, a top view of the semiconductor arrangement 100 isprovided, in accordance with some embodiments. The uppermost device 300Dis visible in FIG. 4. The devices 300A, 300B, 300C, 300D each comprise adevice layer 305A, 305B, 305C, 305D and a metallization layer 310A,310B, 310C, 310D. The metallization layers 310A, 310B, 310C, 310D mayinclude multiple layers, such as the metallization layers M0-Mx shown inFIG. 1. In some embodiments, the metallization layers 310A, 310B, 310C,310D each comprise the passivation layers 220, 250, the polyimide layer235, and the conductive contact pads 225, 230, 255, 260. At least someof the devices 300A, 300B, 300C, 300D comprise the first region 110including the TSV structure 210 and the second region 115 including theTSV structure 215. In some embodiments, the TSV structures 210, 215 donot extend through the lowermost device 300A, but rather, the TSVstructures 210, 215 conductively contact conductive contact pads on theuppermost surface of the device 300A.

In some embodiments, the first region 110 comprises a core region andthe second region 115 comprises an I/O region. In some embodiments,power plane connections may be provided in the second region 115. Insome embodiments, the first region 110 and the second region 115 operateusing different supply voltages. In some embodiments, a first supplyvoltage of the first region 110 is less than a second supply voltage ofthe second region 115. In some embodiments, the TSV structure 210 has afirst cross-sectional area and the TSV structure 215 has a secondcross-sectional area greater than the first cross-sectional area. Thefirst cross-sectional area and the second cross-sectional area arecompared in the same plane, since the TSV structures 210, 215 may taperalong their lengths. The increased cross-sectional area of the TSVstructure 215 results in reduced resistive power losses. In someembodiments, the first region 110 has an increased density of TSVstructures 210 compared to the density of the TSV structures 215 in thesecond region 115, tending to increase performance in the first region110.

Referring to FIG. 5, a top view of the semiconductor arrangement 100 isprovided, in accordance with some embodiments. The uppermost device 300Dis visible in FIG. 5. The devices 300A, 300B, 300C, 300D each comprise adevice layer 305A, 305B, 305C, 305D and a metallization layer 310A,310B, 310C, 310D. The metallization layers 310A, 310B, 310C, 310D mayinclude multiple layers, such as the metallization layers M0-Mx shown inFIG. 1. In some embodiments, the metallization layers 310A, 310B, 310C,310D each comprise the passivation layer 220, 250, the polyimide layer235, and the conductive contact pads 225, 230, 255, 260. At least someof the devices 300A, 300B, 300C, 300D comprise first regions 110A, 110Bincluding the TSV structure 210 and the second region 115 including theTSV structure 215. In some embodiments, the TSV structures 210, 215 donot extend through the lowermost device 300A, but rather, the TSVstructures 210, 215 conductively contact conductive contact pads on theuppermost surface of the device 300A.

In some embodiments, the first regions 110A, 110B comprises core regionsand the second region 115 comprises an I/O region. In some embodiments,power plane connections may be provided in the second region 115. Insome embodiments, the first regions 110A, 110B and the second region 115operate using different supply voltages. In some embodiments, a firstsupply voltage of the first regions 110A, 110B is less than a secondsupply voltage of the second region 115. In some embodiments, the TSVstructure 210 has a first cross-sectional area and the TSV structure 215has a second cross-sectional area greater than the first cross-sectionalarea. The first cross-sectional area and the second cross-sectional areaare compared in the same plane, since the TSV structures 210, 215 maytaper along their lengths. The increased cross-sectional area of the TSVstructure 215 results in reduced resistive power losses. In someembodiments, the first regions 110A, 110B have an increased density ofTSV structures 210 compared to the density of the TSV structures 215 inthe second region 115, tending to increase performance in the firstregions 110A, 110B.

Referring to FIG. 6, a top view of the semiconductor arrangement 100 isprovided, in accordance with some embodiments. The uppermost device 300Dis visible in FIG. 6. The devices 300A, 300B, 300C, 300D each comprise adevice layer 305A, 305B, 305C, 305D and a metallization layer 310A,310B, 310C, 310D. The metallization layers 310A, 310B, 310C, 310D mayinclude multiple layers, such as the metallization layers M0-Mx shown inFIG. 1. In some embodiments, the metallization layers 310A, 310B, 310C,310D each comprise the passivation layers 220, 250, the polyimide layer235, and the conductive contact pads 225, 230, 255, 260. At least someof the devices 300A, 300B, 300C, 300D comprise first regions 110A, 110Bincluding the TSV structure 210 and second regions 115A, 115B includingthe TSV structure 215. In some embodiments, the TSV structures 210, 215do not extend through the lowermost device 300A, but rather, the TSVstructures 210, 215 conductively contact conductive contact pads on theuppermost surface of the device 300A.

In some embodiments, the first regions 110A, 110B comprises core regionsand the second regions 115A, 115B comprise I/O regions. In someembodiments, power plane connections may be provided in one or both ofthe second regions 115A, 115B. In some embodiments, the first regions110A, 110B and the second regions 115A, 115B operate using differentsupply voltages. In some embodiments, a first supply voltage of thefirst regions 110A, 110B is less than a second supply voltage of thesecond regions 115A, 115B. In some embodiments, the TSV structure 210has a first cross-sectional area and the TSV structure 215 has a secondcross-sectional area greater than the first cross-sectional area. Thefirst cross-sectional area and the second cross-sectional area arecompared in the same plane, since the TSV structures 210, 215 may taperalong their lengths. The increased cross-sectional area of the TSVstructure 215 results in reduced resistive power losses. In someembodiments, the first regions 110A, 110B have an increased density ofTSV structures 210 compared to the density of the TSV structures 215 inthe second regions 115A, 115B, tending to increase performance in thefirst regions 110A, 110B.

Referring to FIG. 7, a top view of the semiconductor arrangement 100 isprovided, in accordance with some embodiments. The uppermost device 300Dis visible in FIG. 7. The devices 300A, 300B, 300C, 300D each comprise adevice layer 305A, 305B, 305C, 305D and a metallization layer 310A,310B, 310C, 310D. The metallization layers 310A, 310B, 310C, 310D mayinclude multiple layers, such as the metallization layers M0-Mx shown inFIG. 1. In some embodiments, the metallization layers 310A, 310B, 310C,310D each comprise the passivation layers 220, 250, the polyimide layer235, and the conductive contact pads 225, 230, 255, 260. At least someof the devices 300A, 300B, 300C, 300D comprise first regions 110A, 110Bincluding the TSV structure 210, a second region 115 including the TSVstructure 215, and third regions 117A, 117B, 117C including the TSVstructure 217. In some embodiments, the TSV structures 210, 215, 217 donot extend through the lowermost device 300A, but rather, the TSVstructures 210, 215, 217 conductively contact conductive contact pads onthe uppermost surface of the device 300A.

In some embodiments, the first regions 110A, 110B comprise core regions,the second region 115 comprises an I/O region, and the third regions117A, 117B, 117C comprises power distribution regions. In someembodiments, the first regions 110A, 110B and the second region 115operate using different supply voltages. In some embodiments, a firstsupply voltage of the first regions 110A, 110B is less than a secondsupply voltage of the second region 115. In some embodiments, the thirdregions 117A, 117B, 117C are power planes for providing power for thedevices 300A, 300B, 300C, 300D at the second supply voltage, which isstepped down to the first supply voltage to supply power to the firstregions 110A, 110B. In some embodiments, the TSV structure 210 has afirst cross-sectional area, the TSV structure 215 has a secondcross-sectional area greater than the first cross-sectional area, andthe TSV structure 217 has a third cross-sectional area greater than thesecond cross-sectional area. The first cross-sectional area, the secondcross-sectional area, and the third cross-sectional area are compared inthe same plane, since the TSV structures 210, 215, 217 may taper alongtheir lengths. The increased cross-sectional areas of the TSV structures215, 217 result in reduced resistive power losses. In some embodiments,the first regions 110A, 110B have an increased density of TSV structures210 compared to the density of the TSV structures 215, 217 in theregions 115 117A, 117B, 117C, tending to increase performance in thefirst regions 110A, 110B.

Referring to FIG. 7A, a top view of portions of the semiconductorarrangement 100 is provided, according to some embodiments. In someembodiments, the semiconductor arrangement 100 comprises a TSV structure700 having an elliptical cross-sectional shape defined by a first axis705 and a second axis. In some embodiments, the first axis 705 is longerthan the second axis 710. In some embodiments, the first axis 705 andthe second axis 710 have the same length, defining an ellipse that isalso a circle. In some embodiments, the semiconductor arrangement 100comprises a TSV structure 715 having a rectangular cross-sectional shapedefined by a first dimension 720 and a second dimension 725. In someembodiments, the first dimension 720 is longer than the second dimension725. In some embodiments, the first dimension 720 and the seconddimension 725 have the same length, defining a rectangle that is also asquare. In some embodiments, the TSV structures 210, 215, 217 have thesame cross-sectional shapes, such as the elliptical cross-sectionalshape of the TSV structure 700 or the rectangular cross-sectional shapeof the TSV structure 715, albeit with different axis lengths ordimensions to provide differing cross-sectional areas.

In some embodiments, the TSV structures 210, 215, 217 have differentcross-sectional shapes. For example, some of the TSV structures 210,215, 217 may have elliptical cross-sectional shapes, such as theelliptical cross-sectional shape of the TSV structure 700, and others ofthe TSV structures 210, 215, 217 may have rectangular cross-sectionalshapes, such as the rectangular cross-sectional shape of the TSVstructure 715, albeit with different axis lengths or dimensions toprovide differing cross-sectional areas.

Providing the TSV structures 210, 215, 217 with differingcross-sectional areas allows for design flexibility and improvesperformance. Resistance is reduced in regions with larger TSV structures215, 217, such as input/output regions or power supply regions, therebydecreasing power consumption. Density is increased in regions withsmaller TSV structures 210, such as core regions, thereby increasingperformance.

FIG. 8 is a flow diagram illustrating a method 800 for forming asemiconductor arrangement, in accordance with some embodiments. At 802,a first device, such as device 300B, with a first TSV structure having afirst cross-sectional area, such as the TSV structure 210, is formed ina first region, such as the first region 110, of the first device and asecond TSV structure having a second cross-sectional area, such as atleast one of the TSV structures 215, 217, greater than the firstcross-sectional area is formed in a second region, such as the secondregion 115 or the third region 117, of the first device. At 804, asecond device, such as device 300C, with a first TSV structure havingthe first cross-sectional area, such as the TSV structure 210, is formedin a first region, such as the first region 110, of the second deviceand a second TSV structure having the second cross-sectional area, suchas at least one of the TSV structures 215, 217, is formed in a secondregion, such as the second region 115 or the third region 117, of thesecond device. At 806, the first device is aligned with the seconddevice to connect the first TSV structure of the first device with thefirst TSV structure of the second device and to connect the second TSVstructure of the first device with the second TSV structure of thesecond device.

Still another embodiment involves a computer-readable medium comprisingprocessor-executable instructions configured to implement one or more ofthe techniques presented herein. An exemplary computer-readable mediumis illustrated in FIG. 9, wherein the embodiment 900 comprises acomputer-readable medium 902 (e.g., a CD-R, DVD-R, flash drive, aplatter of a hard disk drive, etc.), on which is encodedcomputer-readable data 904. This computer-readable data 904 in turncomprises a set of processor-executable computer instructions 906configured to operate according to one or more of the principles setforth herein. In some embodiments 900, the processor-executable computerinstructions 906 are configured to perform a method 908, such as atleast some of the aforementioned described method. In some embodiments,the processor-executable computer instructions 906 are configured toimplement a system. Many such computer-readable media may be devised bythose of ordinary skill in the art that are configured to operate inaccordance with the techniques presented herein.

FIG. 10 and the following discussion provide a brief, generaldescription of a suitable computing environment to implement embodimentsof one or more of the provisions set forth herein. The operatingenvironment of FIG. 10 is only one example of a suitable operatingenvironment and is not intended to suggest any limitation as to thescope of use or functionality of the operating environment. Examplecomputing devices include, but are not limited to, personal computers,server computers, hand-held or laptop devices, mobile devices (such asmobile phones, Personal Digital Assistants (PDAs), media players, andthe like), multiprocessor systems, consumer electronics, mini computers,mainframe computers, distributed computing environments that include anyof the above systems or devices, and the like.

Although not required, embodiments are described in the general contextof “computer readable instructions” being executed by one or morecomputing devices. Computer readable instructions may be distributed viacomputer readable media (discussed below). Computer readableinstructions may be implemented as program modules, such as functions,objects, Application Programming Interfaces (APIs), data structures, andthe like, that perform particular tasks or implement particular abstractdata types. Typically, the functionality of the computer readableinstructions may be combined or distributed as desired in variousenvironments.

FIG. 10 depicts an example of a system 1000 comprising a computingdevice 1002 to implement some embodiments provided herein. In someconfigurations, computing device 1002 includes at least one processingunit 1004 and memory 1006. Depending on the exact configuration and typeof computing device, the memory 1006 may be volatile (such as randomaccess memory (RAM), for example), non-volatile (such as read-onlymemory (ROM), flash memory, etc., for example) or some combination ofthe two. This configuration is illustrated in FIG. 10 by dashed line1008.

In some embodiments, the computing device 1002 may include additionalfeatures and/or functionality. For the example, the computing device1002 may also include additional storage (e.g., removable and/ornon-removable) including, but not limited to, magnetic storage, opticalstorage, and the like. Such additional storage is illustrated in FIG. 10by storage 1010. In some embodiments, computer readable instructions toimplement one or more embodiments provided herein may be in the storage1010. The storage 1010 may also store other computer readableinstructions to implement an operating system, an application program,and the like. Computer readable instructions may be loaded in the memory1006 for execution by processing unit 1004, for example.

The term “computer readable media” as used herein includes computerstorage media. Computer storage media includes volatile and nonvolatile,removable and non-removable media implemented in any method ortechnology for storage of information such as computer readableinstructions or other data. The memory 1006 and storage 1010 areexamples of computer storage media. Computer storage media includes, butis not limited to, RAM, ROM, electrically erasable programmableread-only memory (EEPROM), flash memory, or other memory technology,CD-ROM, Digital Versatile Disks (DVDs), or other optical storage,magnetic cassettes, magnetic tape, magnetic disk storage, or othermagnetic storage devices, or any other medium which can be used to storethe desired information and which can be accessed by the computingdevice 1002. Any such computer storage media may be part of thecomputing device 1002.

In some embodiments, the computing device 1002 comprises a communicationinterface 1012, or a multiple communication interfaces, that allow thecomputing device 1002 to communicate with other devices. Thecommunication interface 1012 may include, but is not limited to, amodem, a Network Interface Card (NIC), an integrated network interface,a radio frequency transmitter/receiver, an infrared port, a UniversalSerial Bus (USB) connection, or other interface for connecting thecomputing device 1002 to other computing devices. The communicationinterface 1012 may implement a wired connection or a wirelessconnection. The communication interface 1012 may transmit and/or receivecommunication media.

The term “computer readable media” may include communication media.Communication media typically embodies computer readable instructions orother data in a “modulated data signal” such as a carrier wave or othertransport mechanism and includes any information delivery media. Theterm “modulated data signal” may include a signal that has one or moreof its characteristics set or changed in such a manner as to encodeinformation in the signal.

The computing device 1002 may include input device(s) 1014 such askeyboard, mouse, pen, voice input device, touch input device, infraredcameras, video input devices, and/or any other suitable input device. Anoutput device(s) 1016, such as one or more displays, speakers, printers,and/or any other suitable output device, may also be included in thecomputing device 1002. The input device(s) 1014 and the output device(s)1016 may be connected to the computing device 1002 via a wiredconnection, wireless connection, or any combination thereof. In someembodiments, an input device or an output device from another computingdevice may be used as the input device(s) 1014 or the output device(s)1016 for the computing device 1002.

Components of the computing device 1002 may be connected by variousinterconnects, such as a bus. Such interconnects may include aPeripheral Component Interconnect (PCI), such as PCI Express, a USB,firewire (IEEE 1394), an optical bus structure, and the like. In someembodiments, components of the computing device 1002 may beinterconnected by a network. For example, the memory 1006 may becomprised of multiple physical memory units located in differentphysical locations interconnected by a network.

Those skilled in the art will realize that storage devices utilized tostore computer readable instructions may be distributed across anetwork. For example, a computing device 1018 accessible via a network1020 may store computer readable instructions to implement one or moreembodiments provided herein. The computing device 1002 may access thecomputing device 1018 and download a part or all of the computerreadable instructions for execution. Alternatively, the computing device1002 may download pieces of the computer readable instructions, asneeded, or some instructions may be executed at the computing device1002 and some instructions may be executed at the computing device 1018.

According to some embodiments, a method of forming a semiconductorarrangement includes forming a first device with a first throughsubstrate via (TSV) structure in a first region of the first device anda second TSV structure in a second region of the first device. A seconddevice is formed with a first TSV structure in a first region of thesecond device and a second TSV structure in a second region of thesecond device. The first device is aligned with the second device toconnect the first TSV structure of the first device with the first TSVstructure of the second device and to connect the second TSV structureof the first device with the second TSV structure of the second device.The first TSV structure of the first device and the first TSV structureof the second device have a first cross-sectional area. The second TSVstructure of the first device and the second TSV structure of the seconddevice have a second cross-sectional area greater than the firstcross-sectional area.

According to some embodiments, a semiconductor arrangement includes adevice having a first surface and a second surface opposite the firstsurface. A first through substrate via (TSV) structure extends betweenthe first surface and the second surface in a first region of thedevice. A second TSV structure extends between the first surface and thesecond surface in a second region of the device. The first TSV structurehas a first cross-sectional area. The second TSV structure has a secondcross-sectional area greater than the first cross-sectional area.

According to some embodiments, a semiconductor arrangement includes afirst device with a first through substrate via (TSV) structure in afirst region of the first device, a second TSV structure in a secondregion of the first device, and a third TSV structure in a third regionof the first device. A second device includes a first TSV structure in afirst region of the second device conductively contacting the first TSVstructure of the first device, a second TSV structure in a second regionof the second device conductively contacting the second TSV structure ofthe first device, and a third TSV structure in a third region of thesecond device conductively contacting the third TSV structure of thefirst device. The first TSV structure of the first device and the firstTSV structure of the second device have a first cross-sectional area.One of the second TSV structure of the first device and the second TSVstructure of the second device or the third TSV structure of the firstdevice and the third TSV structure of the second device has a secondcross-sectional area greater than the first cross-sectional area.

The foregoing outlines features of several embodiments so that those ofordinary skill in the art may better understand various aspects of thepresent disclosure. Those of ordinary skill in the art should appreciatethat they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying outthe same purposes and/or achieving the same advantages of variousembodiments introduced herein. Those of ordinary skill in the art shouldalso realize that such equivalent constructions do not depart from thespirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

Although the subject matter has been described in language specific tostructural features or methodological acts, it is to be understood thatthe subject matter of the appended claims is not necessarily limited tothe specific features or acts described above. Rather, the specificfeatures and acts described above are disclosed as example forms ofimplementing at least some of the claims.

Various operations of embodiments are provided herein. The order inwhich some or all of the operations are described should not beconstrued to imply that these operations are necessarily orderdependent. Alternative ordering will be appreciated having the benefitof this description. Further, it will be understood that not alloperations are necessarily present in each embodiment provided herein.Also, it will be understood that not all operations are necessary insome embodiments.

It will be appreciated that layers, features, elements, etc., depictedherein are illustrated with particular dimensions relative to oneanother, such as structural dimensions or orientations, for example, forpurposes of simplicity and ease of understanding and that actualdimensions of the same differ substantially from that illustratedherein, in some embodiments. Additionally, a variety of techniques existfor forming the layers, regions, features, elements, etc. mentionedherein, such as at least one of etching techniques, planarizationtechniques, implanting techniques, doping techniques, spin-ontechniques, sputtering techniques, growth techniques, or depositiontechniques such as CVD, for example.

Moreover, “exemplary” is used herein to mean serving as an example,instance, illustration, etc., and not necessarily as advantageous. Asused in this application, “or” is intended to mean an inclusive “or”rather than an exclusive “or”. In addition, “a” and “an” as used in thisapplication and the appended claims are generally be construed to mean“one or more” unless specified otherwise or clear from context to bedirected to a singular form. Also, at least one of A and B and/or thelike generally means A or B or both A and B. Furthermore, to the extentthat “includes”, “having”, “has”, “with”, or variants thereof are used,such terms are intended to be inclusive in a manner similar to the term“comprising”. Also, unless specified otherwise, “first,” “second,” orthe like are not intended to imply a temporal aspect, a spatial aspect,an ordering, etc. Rather, such terms are merely used as identifiers,names, etc. for features, elements, items, etc. For example, a firstelement and a second element generally correspond to element A andelement B or two different or two identical elements or the sameelement.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others of ordinary skill in the art based upon a readingand understanding of this specification and the annexed drawings. Thedisclosure comprises all such modifications and alterations and islimited only by the scope of the following claims. In particular regardto the various functions performed by the above described components theterms used to describe such components are intended to correspond,unless otherwise indicated, to any component which performs thespecified function of the described component (e.g., that isfunctionally equivalent), even though not structurally equivalent to thedisclosed structure. In addition, while a particular feature of thedisclosure may have been disclosed with respect to only one of severalimplementations, such feature may be combined with one or more otherfeatures of the other implementations as may be desired and advantageousfor any given or particular application.

1. A method of forming a semiconductor arrangement, comprising: forminga first device with a first through substrate via (TSV) structure in afirst region of the first device and a second TSV structure in a secondregion of the first device; forming a second device with a first TSVstructure in a first region of the second device and a second TSVstructure in a second region of the second device; and aligning thefirst device with the second device to connect the first TSV structureof the first device with the first TSV structure of the second deviceand to connect the second TSV structure of the first device with thesecond TSV structure of the second device, wherein: the first TSVstructure of the first device and the first TSV structure of the seconddevice have a first cross-sectional area, and the second TSV structureof the first device and the second TSV structure of the second devicehave a second cross-sectional area greater than the firstcross-sectional area.
 2. The method of claim 1, wherein the first regionof the first device and the first region of the second device comprisecore regions.
 3. The method of claim 1, wherein the second region of thefirst device and the second region of the second device compriseinput/output regions.
 4. The method of claim 1, wherein: forming thefirst device comprises forming the first device with a third TSVstructure in a third region of the first device, forming the seconddevice comprises forming the second device with a third TSV structure ina third region of the second device, aligning the first device with thesecond device comprises aligning the first device with the second deviceto connect the third TSV structure of the first device with the thirdTSV structure of the second device, and the third TSV structure of thefirst device and the third TSV structure of the second device have athird cross-sectional area greater than the second cross-sectional area.5. The method of claim 1, wherein the first TSV structure of the firstdevice has a rectangular cross-sectional shape.
 6. The method of claim1, wherein the first TSV structure of the first device has an ellipticalcross-sectional shape.
 7. The method of claim 1, wherein: the first TSVstructure of the first device has a first cross-sectional shape, and thesecond TSV structure of the first device has a second cross-sectionalshape different than the first cross-sectional shape.
 8. The method ofclaim 1, wherein: the first region of the first device comprises a firstactive device configured to operate with a first supply voltage, and thesecond region of the first device comprises a second active deviceconfigured to operate with a second supply voltage greater than thefirst supply voltage.
 9. A semiconductor arrangement, comprising: adevice having a first surface and a second surface opposite the firstsurface; a first through substrate via (TSV) structure extending betweenthe first surface and the second surface in a first region of thedevice; and a second TSV structure extending between the first surfaceand the second surface in a second region of the device, wherein: thefirst TSV structure has a first cross-sectional area, and the second TSVstructure has a second cross-sectional area greater than the firstcross-sectional area.
 10. The semiconductor arrangement of claim 9,wherein the first region comprises a core region.
 11. The semiconductorarrangement of claim 9, wherein the second region comprises aninput/output region.
 12. The semiconductor arrangement of claim 9,comprising: a third TSV structure extending between the first surfaceand the second surface in a third region of the device, wherein thethird TSV structure has a third cross-sectional area greater than thesecond cross-sectional area.
 13. The semiconductor arrangement of claim12, wherein the third region comprise a power distribution region. 14.The semiconductor arrangement of claim 9, wherein the first TSVstructure has a rectangular cross-sectional shape.
 15. The semiconductorarrangement of claim 9, wherein the first TSV structure has anelliptical cross-sectional shape.
 16. The semiconductor arrangement ofclaim 9, wherein: the first TSV structure has a first cross-sectionalshape, and the second TSV structure has the first cross-sectional shape.17. The semiconductor arrangement of claim 9, wherein: the first regioncomprises a first transistor configured to operate with a first supplyvoltage, and the second region comprises a second transistor configuredto operate with a second supply voltage greater than the first supplyvoltage.
 18. A semiconductor arrangement, comprising: a first devicewith a first through substrate via (TSV) structure in a first region ofthe first device, a second TSV structure in a second region of the firstdevice, and a third TSV structure in a third region of the first device;and a second device with a first TSV structure in a first region of thesecond device conductively contacting the first TSV structure of thefirst device, a second TSV structure in a second region of the seconddevice conductively contacting the second TSV structure of the firstdevice, and a third TSV structure in a third region of the second deviceconductively contacting the third TSV structure of the first device,wherein: the first TSV structure of the first device and the first TSVstructure of the second device have a first cross-sectional area, andone of the second TSV structure of the first device and the second TSVstructure of the second device or the third TSV structure of the firstdevice and the third TSV structure of the second device has a secondcross-sectional area greater than the first cross-sectional area. 19.The semiconductor arrangement of claim 18, wherein: the second TSVstructure of the first device and the second TSV structure of the seconddevice have the first cross-sectional area, and the third TSV structureof the first device and the third TSV structure of the second devicehave the second cross-sectional area.
 20. The semiconductor arrangementof claim 18, wherein: the second TSV structure of the first device andthe second TSV structure of the second device have the secondcross-sectional area, and the third TSV structure of the first deviceand the third TSV structure of the second device have a thirdcross-sectional different than the first cross-sectional area and thesecond cross-sectional area.